At embedded world, Hema Electronic will be showing a demo of its embedded vision platform with powerful AMD Kria FPGA SoMs and MIPI camera modules from Vision Components for the first time.

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Logimat 2024 will also feature the portfolio of Lapp, the provider of connectivity solutions and branded products in the field of cable and connectivity technology.

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International standardization drives the worldwide use of the communication solution - and guarantees customers manufacturer-independent compatibility of all components.

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SMW-electronics has developed inductive coupling systems to enable the contactless transmission of energy and signals between stationary and moving components in mobile systems.

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Sotronik is the official Qualified Embedded Software Integration Partner of Hilscher Gesellschaft für Systemautomation. Sotronik is thus expanding and deepening its expertise in the field of industrial communication, while users of net-X technology in Switzerland gain a competent partner to solve their challenges.

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International standardization drives the worldwide use of the communication solution - and guarantees customers manufacturer-independent compatibility of all components. As a member of the IO-Link consortium, Balluff was involved in the development.

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At SPS 2023, everything at Balluff revolved around the topic of network technology. Industrial image processing and other solutions for the factory of the future were also on the agenda at the trade fair stand.

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Bosch Rexroth is driving digitalization forward and is making products from its industrial hydraulics portfolio available as digital twins.

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A sustainable cable with a PVC sheath from Lapp has been nominated in the Drive Technology and Automation category in the competition for Product of the Year 2024. The Ölflex Classic FD 810 is the prototype of a cable with a sustainable PVC sheath.

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High reliability with minimal latency is just one aspect of the appeal of 5G. In particular, safety transmission via such a mobile network is proving to be a much-discussed topic. The next generation of the standard now promises a major step forward for wireless industrial data exchange. But will the requirements of industrial users actually be met, or is this still wishful thinking?

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