Hema Electronic at the embedded world
Embedded vision with AMD Kria and MIPI cameras
At embedded world, Hema Electronic will be showing a demo of its embedded vision platform with powerful AMD Kria FPGA SoMs and MIPI camera modules from Vision Components for the first time.
This provides project customers with a platform that combines the highest computing power for low-latency, sensor fusion and other complex image processing tasks with ultra-compact, industrial-grade and easy-to-integrate MIPI cameras. In addition, hema will be presenting its service portfolio for individual embedded vision electronics, from development and production to lifecycle management at the Aalen site.
As an expert in highly complex FPGA projects, hema electronic offers solutions for applications in which signals from up to 24 cameras and other sensors are processed and in which one or more powerful System on Modules take over complex computing applications, even in real time and with mission-critical requirements. A new feature at embedded world is the integration of MIPI CSI2 cameras with the AMD Kria platform. This gives customers even more flexibility in their choice of camera sensors. The first MIPI modules to be integrated are VC MIPI cameras, which are available in numerous sensor variants and are characterized by industrial-grade quality and long-term availability. hema is an AMD Adaptive Computing Partner Premier and one of the few developers of mainboards for the AMD Kria platform at the highest partnership level. Customers benefit from exclusive access to tools and resources related to the AMD Kria environment and the close cooperation between the two companies in the development of new products.
In development projects, hema electronic combines the experience of over 45 years in the electronics industry and over 30 years in the field of embedded vision with the latest technologies. The company supports customers from the project idea and development through the production of prototypes to series hardware and throughout the entire life cycle. Typical batch sizes are in the range of 1-1000 electronics per year, which hema electronic can produce economically thanks to efficient processes and strategies. Special features include the Fastlane board service and the modular hema Embedded Vision platform, which together enable the development and production of individual electronics ideally in just 30 days and thus form the basis for rapid market entry. The use of identical parts in different projects and the active and continuous testing of obsolescence risks throughout the entire life cycle lead to maximum availability of production-ready electronics, even in difficult delivery situations and over many years. By working together, hema expands the expertise of its customers in an ideal and tailor-made way; on request, the embedded vision specialist can also take on the testing of hardware and software as well as the assembly of complete devices, for example.
embedded world, Hall 2, Stand 2-444









