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Subrack

Andreas Mühlbauer,

High bandwidth of system integration

Heitec presents subrack elements based on new architectures that are primarily designed for serial backplane technology, high speeds and the simple construction of modular platforms.

Heitec at Embedded World 2019: All exhibits will be presented on HeiCase systems, for which the range of accessories has been expanded. © Heitec

The HeiCool ECO 1 HU fan tray opens up greater mounting options for various installation situations. It can be used flexibly, for example as a slide-in unit in the control cabinet, with 19" mounting or permanently integrated. The range of accessories for the HeiCase line from Heitec has been greatly expanded. The additions are made up of the categories shelves, front panels and cable management as well as a document compartment. The demos include high-end system platforms for a high-availability carrier-grade application of the network node of a high-speed optical transmission network.

Embedded World, Hall 1, Stand 340

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