SubrackHigh bandwidth of system integration
Heitec presents subrack elements based on new architectures that are primarily designed for serial backplane technology, high speeds and the simple construction of modular platforms.
Page [1 of 1]
 | | | Image 1 of 1 | | | |
Heitec at Embedded World 2019: All exhibits will be presented on HeiCase systems, for which the range of accessories has been expanded. © Heitec