Embedded World 2026 in Nuremberg
Five expert panels provide impetus for technology and regulation
The embedded industry will meet again in Nuremberg: This year's embedded world Exhibition & Conference offers a top-class forum program with five expert panels in which executives from the semiconductor industry, automotive, IT security and artificial intelligence will discuss key technological and regulatory issues.
The focus is not only on new products, but also on setting the strategic course for an industry that is evolving in the field of tension between digitalization, security and regulation.
Strategic trends from a management perspective
Under the title "c level@embedded world", top managers from leading technology companies will discuss current challenges and future prospects for the embedded market.
This year's participants include executives from AMD, Green Hills Software, Lattice Semiconductor and onsemi. The panel will be moderated by Prof. Dr.-Ing. Axel Sikora, Chairman of the embedded world Conference.
Date: Tuesday, March 10, 1:30 to 2:30 p.m., Hall 3, Stand 3 611.
RISC V in the car: open architecture under pressure to prove itself
How suitable is the open processor architecture RISC V for use in vehicles - and is the automotive industry ready for this step?
The panel "Is RISC V Ready for Automotive? Is Automotive Ready for RISC V?". Representatives from Quintauris, Infineon, SiFive and Siemens EDA will shed light on the technical requirements in the automotive environment, the advantages of open architectures and open questions relating to security, software ecosystems and new chip architectures.
The panel will be moderated by Andrea Gallo, CEO of RISC V International.
Date: Wednesday, March 11, 11:30 a.m. to 12:30 p.m., Hall 5, Stand 5 210.
EU cyber regulation meets industrial practice
The EU Cyber Resilience Act (CRA) is tightening the regulatory framework for manufacturers of products with digital components. The panel "Navigating the EU Cyber Resilience Act: From Policy to Practice" sheds light on the consequences of the requirements for companies and supply chains.
Experts from the EU Commission, the German Federal Office for Information Security (BSI) and CENELEC will discuss requirements such as the Software Bill of Materials (SBOM), vulnerability handling and CE conformity as well as the economic implications for complex global value chains.
The practical hurdles that companies have to overcome during implementation become clear - from additional development and security processes to the complexity of international supply structures and the challenge of reconciling fast innovation cycles with strict regulatory requirements.
Moderation: Preeti Ohri Khemani, Senior Director CSS SRI, Infineon Technologies.
Date: Wednesday, March 11, 1:30 to 2:30 p.m., Hall 3, Stand 3 611.
Cybersecurity for software-defined vehicles
With increasing connectivity and the shift of functions to software, new attack surfaces are emerging in cars. The panel "Emerging Cybersecurity Strategies for Software Defined Vehicles" is dedicated to precisely these challenges.
Experts from NXP, ARM, Judge Group, Aumovio and Siemens will discuss security concepts - from the hardware root of trust to secure boot mechanisms and the protection of over-the-air updates through to AI-supported methods for attack detection.
The host is Nicholas Glewicz, Vice President of the Judge Group.
Date: Thursday, March 12, 11:30 a.m. to 12:30 p.m., Hall 5, Stand 5 210.
Embedded vision and physical AI: new hardware for new applications
Artificial intelligence and image processing are driving the development of intelligent systems. The panel "Embedded Vision on the Rise" will shed light on how modern GPU and NPU architectures as well as concepts of "Physical AI" enable new applications.
Representatives from FRAMOS, Allied Vision, MVTec and Intel will discuss performance requirements, edge AI optimization, sensor technology, cost efficiency and future fields of application - from robotics and smart devices to industrial automation.
Moderation: Anne Wendel, VDMA Robotics + Automation.
Date: Thursday, March 12, 1:30 to 2:30 p.m., Hall 3, Stand 3 611.
Platform for technology and exchange
The embedded world Exhibition & Conference sees itself as a global platform and central industry meeting point for the international embedded community. The event covers the entire spectrum of embedded systems - from components and modules to operating systems, hardware and software design, M2M communication and complex system design.
In addition to the trade fair itself, the supporting program is an important component: the embedded world Conference and the electronic displays Conference offer in-depth technical knowledge and scientific exchange. Exhibitor forums, expert presentations and panels complement the program in the exhibition halls.
The offer is supplemented by formats for young talent and the community: the Student Day for young talents, the Start-up City as a presentation platform for young companies and the networking event #women4ew, which specifically networks and promotes women in the embedded industry.









