Presence fair in preparationSoftware for assembly conquers Motek/Bondexpo 2021

This year's Motek/Bondexpo is in full preparation as a presence trade fair. The industry is looking forward to the traditional trade fair duo, the 39th Motek - International Trade Fair for Production and Assembly Automation and the 14th Bondexpo - International Trade Fair for Adhesive Bonding Technology. The topic of "Software for Assembly" and the "Arena of Integration" will occupy a central place in Hall 1.