The topic of "Software for Assembly" and the "Arena of Integration" will occupy a central place in Hall 1.

For the first time at Motek 2021, a new "Software for Assembly" exhibition area will create a unique platform for the digitalization of production and assembly. The presentation is structured along the product lifecycle and covers several topics: Software for product lifecycle management, for sales, for service and for development and design. Particular attention will be paid to software for production and assembly as well as machine-related software and control technology. The "Arena of Integration" (AoI) is also being prepared as a show highlight: "The AoI will be further developed for Motek 2021 as the living heart of the 'Software for Assembly' exhibition area," says Mike Döring from the project management team at trade fair organizer P.E. Schall. "Here, the networking of software and assembly technology in motion will make the business processes mapped by software clearly visible and tangible through exhibits."

The Motek/Bondexpo flags. © P.E. Schall

Assembly companies and their suppliers of assembly technology are one of the largest markets for operational software solutions. For these two target groups, which are traditionally represented at the Motek trade fair, the digitalization of assembly is a central, current challenge. "Decision-makers from sales and design are present at Motek as regular exhibitors," explains Döring. "We bring them together with the right trade visitors at Motek/Bondexpo: Plant managers, planners and buyers." In this way, users receive direct answers to their specific questions from the manufacturers of series variant products.

Motek/Bondexpo supports networking

The industrial manufacturing sector is constantly implementing networking, digitalization and automation. In line with the trade fair motto "automation intelligence for production and assembly", Motek/Bondexpo transfers these topics into practice. Exhibitors can realize their presentations with their own area or via a joint stand. "We support networking in practice," says Döring, explaining the cooperation at various levels. Many interesting complete solutions will therefore be on show at the trade fair, including for new markets.

The Motek/Bondexpo trade fair duo once again demonstrates the optimum interaction between all participants. The complementary Bondexpo focuses on industrial joining and bonding technology: it can be used to join almost any combination of materials, whether they are identical or different, without losing the material properties and associated advantages. The trade fair highlight of the fall from October 5 to 8, 2021 in Stuttgart is firmly on the calendar as a personal meeting of the business community.