GrindTec 2018
Okamoto has the right solution for every sanding task
From lapping and polishing technology to semiconductor equipment and all industrial grinding applications - at GrindTec, the grinding machine manufacturer Okamoto will once again be presenting a broad portfolio of grinding solutions for all important key industries such as tool, machine and vehicle construction as well as the aerospace, semiconductor, wafer and optical industries.
For example, with the ACC CA3 (image) for surface and profile grinding. It combines modern control technology from Fanuc with three CNC main axes and up to five additional auxiliary axes, for example for swivel dressing systems or dividing heads.
The UPZ 52 Li ultra-precision micro profile grinding machine is a high-performance system concept designed to meet industry requirements for high-precision profile grinding tasks in tool and mold making. The linear motor technology and machine elements for reducing heat and vibrations are the basis for high productivity, extreme accuracy and short machining times.
Okamoto provides the AeroLap finishing system for ultra-fine lapping of irregular profiles, even on small tools and components. Thanks to the special MultiCone suspension, an automated lapping process is possible without changing the geometry of the machined component. cs
GrindTec, Hall P, Stand 9128
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