In addition, TQ will be exhibiting numerous other modules, carrier boards and single board computers based on processors and controllers from Intel, NXP, Renesas and Texas Instruments at Stand 5-125 in Hall 5. Presentations on the topics of E²MS and obsolescence management round off the range of products and services.

With the new assemblies, TQ is expanding its product range and making it easier for users to access the latest technology. "From low-power designs for tough real-time requirements to topics such as machine learning and AI, we are helping developers to master current challenges more quickly," emphasizes Konrad Zöpf, Deputy Director TQ-Embedded.

Real-time specialists

TQMa243xL and TQMa64xxL are pin-compatible with each other and are based on the Sitara AM243x and AM64xx series from Texas Instruments. They share the basic structure of one to four Arm Cortex-R5F cores for real-time tasks in combination with an Arm Cortex-M4F core for safety-relevant tasks. In addition, there are two Programmable Real-Time Units (PRUs) for industrial communication such as fieldbuses and real-time Ethernet including TSN support. The AM64xx series also has up to two Arm Cortex-A53 cores. In addition to the pin-out, the modules also share the dimensions of 38 mm x 38 mm.

"This makes the modules considerably easier to integrate into the target hardware. Thanks to the versatility of the processors and the very good power dissipation of typically 1 to 2 watts, these modules offer multiple application possibilities for control tasks in automation and time-critical application scenarios in the IIoT," explains Andreas Willig, Product Manager at TQ-Embedded.

Crossover platform

Another solderable module series is TQMa117xL based on the i.MX RT1170 crossover MCU from NXP. It offers a high level of integration, including high-speed interfaces, improved security functions and hardware support for graphical applications.

TQ also offers the STKa117xL evaluation kit for an easy introduction to this module technology. "We have implemented all relevant interfaces integrated in the module as industrial-grade interfaces on the carrier board. Thanks to the numerous interfaces and the small size of 160 mm x 100 mm, it can be used in a wide variety of applications without the need for a separate board design," explains Konrad Zöpf.

High-performance specialist

The TQMx110EB in turn sets standards in terms of CPU, GPU and system performance for COM Express modules and is offered with long-term available embedded processors: The 11th generation Intel Core and Xeon processors are particularly energy-efficient thanks to the 10 nm manufacturing process. Both versions with 45 W CPU Thermal Design Power (TDP) and more economical versions with 25 W CPU TDP are available for the realization of fanless systems. The COM Express Basic module measures 125 mm x 95 mm and has a Type 6 pin-out.

"The Tiger-Lake CPU generation used in the TQMx110EB is the pinnacle of the classic, established Intel architecture," explains Harald Maier, Product Manager at TQ-Embedded. "With the 12th generation of Intel Core processors (Alder-Lake-P), which we will support with our TQMx120UC, the performance hybrid architecture will be introduced, consisting of a mix of performance and efficiency cores, which is automatically controlled by the Intel Thread Director to ensure an optimum balance between extremely high computing power and high energy efficiency. Together, the two modules cover a very broad range of applications and are offered with a long-term availability of 15 years."

TQ-Embedded presents starter kit

One argument in favor of the SMARC standard is the modules' compact dimensions of 82 mm x 50 mm. This makes them particularly suitable for use in cramped installation situations. However, most starter and evaluation kits use larger board formats such as Mini-ITX or ATX. TQ-Embedded has now developed the MB-SMARC-100100-1 starter kit to enable truly practical evaluation in control cabinets or on top-hat rails. With dimensions of 100 mm x 100 mm, the carrier board already has a practical form factor. In addition, the connectors are mounted perpendicular to the board to facilitate cabling at the actual place of use. This allows SMARC 2.1 modules to be tested under real operating conditions.

Despite its compact dimensions, there is still space on the board for up to three M.2 expansion cards. A connector on the side enables flexible expansion with IO/sensor technology (also suitable for rapid prototyping). TQ also wants to further accelerate the development process for its customers with application-optimized kits. For example, the IoT/Connectivity Kit focuses on the latest wireless connections such as 5G, WiFi 6E and Bluetooth 5.2, but does not leave out the classic RS485 with auto-direction switching and standard UART software interface. The AI Machine Vision Kit has a VPU accelerator card with two Intel Movidius modules (Myriad X VPU 2485) and thus offers high AI performance.

"Thanks to advances in the semiconductor sector, applications can now be realized in the smallest of spaces, which until recently were beyond most spatial and price limits," explains Harald Maier. "With our new starter kits, we are not only simplifying access to these technologies, but we have also made sure that the form factor is as close as possible to practical operation. This has enabled us to shorten the path from the lab bench to series production even further."