Opinion

Three questions for...Markus Binder

Increased performance and miniaturization. At SPS IPC Drives, Markus Binder, Managing Partner of Binder, reports on the challenges and trends he sees for connection technology.

Markus Binder, Managing Partner of Binder. © Binder

The motto of this year's SPS IPC Drives is "Smart and Digital Automation". What challenges does this trend pose for connection technology and how are you dealing with them?
The challenge will be to increase performance while at the same time achieving miniaturization. This means that new "mating faces" are required for established sizes. The focus here is particularly on M8 and M12 connectors.

How do you see further development?
For us as a manufacturer, the question is what future requirements will be placed on transmission rates under industrial conditions for which field of application. For example, sensor/actuator single-pair Ethernet (M8), device-to-device connections up to 100 Mbit/1 Gbit (M12D, M8D) or device/controller (backbone) 1 Gbit/10 Gbit (M12X).

What solutions and products will you be presenting to visitors at SPS IPC Drives?
We will be presenting further products for communication standards with different codings and designs. Other important customer-specific solutions with the combination of data & power include: M5 shielded, M8 12-pin, M12 SMT, M12 K+L or the M12 Hybrid.

Hall 10, Stand 300

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