Embedded World 2019
Congatec introduces new embedded boards
Congatec presented the first embedded form factors with the 8th generation of Intel Core Mobile processors at Embedded World.
At Embbedet World 2019, Congatec presented boards with new BGA processors. These offer a performance increase of up to 40 percent compared to the previous U-Series processors. This is made possible by four cores and an overall improved microarchitecture. The new processors provide the basis for the development of embedded variants of a new microarchitecture generation. For rugged embedded form factors, there are hybrid embedded 3.5-inch SBCs, thin Mini-ITX motherboards and COM Express Type 6 modules that combine the advantages of commercial processors with those of rugged embedded boards and modules.
The RAM has been adapted to the performance boost. Two DDR4 SODIMM sockets with up to 2400 MT/s for up to 64 GB are available. USB 3.1 Gen2 is natively supported by the processor. This USB SuperSpeed+ interface enables a data rate of up to 10 Gbit/s, so that uncompressed UHD videos can also be transferred from a camera to a monitor.
The new 3.5-inch SBC provides this performance via a USB-C connector, which also supports DisplayPort++ and the power supply for peripheral devices. A monitor can therefore be connected with one cable for DP, touch and power supply. The COM Express modules support these features via the carrier board.
The other interfaces depend on the form factor; however, all support a total of three independent 60 Hz UHD displays with up to 4096 x 2304 pixels as well as 2x Gigabit Ethernet (1x with TSN support). The new boards and modules have a TDP of 15 W, which is scalable from 10 (800 MHz) to 25 W (up to 4.6 GHz in Turbo Boost mode).
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