
The tiger among processors
Since the move towards the Industrial Internet of Things (IIoT) and Industry 4.0 has picked up speed, processor boards and modules must be able to process exponentially growing amounts of data.

TQ Systems presented a selection of upcoming embedded modules at Embedded World. The latest CPUs from the manufacturers Texas Instruments, Renesas and NXP will be used.

Bachmann is presenting the first member of the M200 CPU family with multi-core technology at SPS IPC Drives. The MH230 dual-core processor module enables users to make their controller fit for future requirements.

Siemens is expanding its portfolio of Simatic S7-1500 advanced controllers with the multifunctional CPU 1518(F)-4 PN/DP MFP platform. This allows high-level language functions to be integrated and stand-alone applications to be created and reused.