Sick at the Interpack 2026
Intelligent sensor technology for the packaging industry
At Interpack 2026, Sick will be showcasing its portfolio of sensor, automation and AI-supported solutions for secure and digitally networked packaging processes in the consumer goods, healthcare and pharmaceutical industries.
Sick is thus positioning itself as a partner for the digital transformation of the packaging industry. The focus is on intelligent sensor solutions, vision and AI-based systems as well as integrated automation technology for optimizing production and quality processes. With the SIG300 IO-Link master, sensor data from the field level is centrally recorded, processed and transferred to IT and cloud systems. The solution supports transparent, efficient and flexible packaging lines and can be integrated via various fieldbus and IIoT interfaces.
In image processing, Sick relies on the AI-supported Sick Nova platform with the new AI Blob Finder, which precisely detects and measures objects and uses them for quality control, sorting and defect detection. The W12 LED NextGen generation of photoelectric sensors is used for demanding detection tasks. The portfolio is complemented by LUTS/LUTX luminescence sensors for detecting invisible markings for product safety and counterfeit protection.
Identification under extreme conditions
In the field of safety technology, Sick's DCM4 and DMM4 offer flexible solutions for safe material flows and efficient muting applications in packaging machines, including reduced cabling and simplified commissioning. Track-and-trace solutions and camera-based code readers such as the Lector85x enable reliable identification even under extreme conditions, for example in deep-freeze warehouses down to -35 °C. Another focus is the switch to 2D codes such as GS1 Data-Matrix as part of the GS1 Sunrise 2027 initiative, which provides additional product information for traceability and sustainability.
Sick can be found at Interpack in Hall 11, Stand G74.
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