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Rohde & Schwarz and Broadcom

Melanie Steinbeck,

Cooperation in testing and validation of Wi-Fi 8 chipsets

The Rohde & Schwarz CMP180 Radio Communication Tester has been validated by Broadcom as a suitable test solution for devices with Wi-Fi 8 connectivity. The cooperation between the two companies provides device manufacturers with integrated test routines and early access to essential resources to bring their products to market faster and ensure maximum reliability for demanding applications such as XR and AI. With advanced features and a wide supported bandwidth range, the CMP180 addresses the technical challenges of Wi-Fi 8 at all stages of the device lifecycle - from development to production.

© Rohde & Schwarz

Rohde & Schwarz, a global provider of measurement solutions, is deepening its collaboration with Broadcom Inc. to enable testing and validation of Wi-Fi 8 chipsets with the CMP180 Radio Communication Tester. This alliance will enable OEMs and ODMs integrating Broadcom's upcoming Wi-Fi 8 chipsets to bring their products to market faster and ensure compliance, performance and reliability.

What can Wi-Fi 8 do?

Wi-Fi 8, which is based on the IEEE 802.11bn specification, promises a quantum leap in wireless connectivity. It is designed to support higher throughput, lower latency, better efficiency in busy spectral environments and optimized performance for XR (eXtended Reality), AI-supported applications, real-time cloud gaming and ultra-high resolution content streaming. To realize these benefits, the test equipment must offer very high channel bandwidths, ultra-high-order modulation, multi-link operation, excellent spectrum efficiency and reliable OTA performance. Rohde & Schwarz has designed the CMP180 Radio Communication Tester with these requirements in mind.

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By working together, Rohde & Schwarz and Broadcom are ensuring that the industry has the test equipment needed to produce high-quality products and deliver on the promise of Wi-Fi 8:

  • Validation of the CMP180 for Wi-Fi 8: Rohde & Schwarz and Broadcom have jointly conducted test campaigns and demonstrated that the CMP180 meets the high technical requirements of Wi-Fi 8 chipsets.
  • Support for the entire device lifecycle: The CMP180 is available as an end-to-end test solution for Wi-Fi 8-enabled devices - from the early development phase (R&D) through design validation to production and quality assurance.

  • Future-proof hardware and bandwidth: The CMP180 offers frequency coverage up to 8 GHz, bandwidths up to 500 MHz, two independent channels (2 x VSA / 2 x VSG), 4 x 4 MIMO support for Wi-Fi networking products and extended RF ports, addressing all new challenges relevant to Wi-Fi 8.

  • Faster time to market: Automated test routines, developed in close collaboration between Rohde & Schwarz and Broadcom, give device manufacturers early access to test vectors, calibration protocols and software frameworks.

  • UHR (Ultra-High Reliability) for Wi-Fi 8: The collaboration enables Wi-Fi 8 devices to reliably provide stable and robust connections.
The CMP180 will be presented at productronica in Munich. © Rohde & Schwarz

The test functions of the CMP180 enable performance to be checked under demanding conditions and ensure the required reliability for applications such as XR, AI, cloud gaming and critical IoT systems.

Goce Talaganov, Vice President Mobile Radio Testers at Rohde & Schwarz, commented: "We are pleased to deepen our partnership with Broadcom to jointly provide a comprehensive test solution for the next generation of Wi-Fi technology. The superior capabilities of the CMP180 and our close collaboration with Broadcom will enable device manufacturers to bring innovative Wi-Fi 8 products to market quickly and confidently."

Gabriel Desjardins, Director of Product Marketing in the Wireless Communications & Connectivity Division at Broadcom Inc. added: "Our partnership with Rohde & Schwarz is energizing the wireless industry. Together, we are enabling Broadcom's customers and partners to take a leading role in Wi-Fi 8 and pave the way for the connectivity of the future."

Source: Rohde & Schwarz

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