Embedded Edge Computing
From high-end to ultra-low power
Congatec will be presenting the entire spectrum of embedded edge computing logic, ranging from high-end edge servers to headless systems for ultra-low-power edge logic.
The presentations will focus on PICMG's upcoming COM-HPC standard and the expanded SMARC ecosystem for the NXP i.MX8 family. A new starter kit for real-time workload consolidation and presentations by Basler and Hacarus will demonstrate the broad spectrum. Congatec will also be presenting new cooling solutions for robust embedded servers and systems that can dissipate up to 100 W TDP without a fan.
With the Intel RFP Ready Kit for real-time workload consolidation, which Congatec has put together with Intel and Real-Time Systems, OEMs can get straight into the development of vision-based collaborative robotics, automation controls and autonomous vehicles.
Embedded World: Hall 1, Stand 358
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