For miniaturization in electronics production, the "SAL-1300" depaneling machine combines laser and milling technology in one machine. © SCHUNK SE & Co. KG

For clean processes and a healthy production environment, it reduces dust residue during milling by up to 70 percent. The SAR-1300 also meets growing requirements, such as unmanned night shifts, increased throughput or autonomous operation over a longer period of time.

Equipped with an optional cobot, which takes over the loading and unloading of the PCBs, and the Schunk board handling systems, the "SAR-1300" becomes a scalable automation solution.

Precise cutting with laser and milling machine

With laser and milling technology, the "SAL-1300" depaneling machine offers two technologies in one. The combination creates new possibilities for applications with the highest quality requirements. The laser separates PCBs dust-free and without mechanical stress, making it particularly gentle on sensitive components. At the same time, it is ideal for miniaturization in electronics production. Thanks to a broad portfolio of laser sources, the right solution is available for every material.
The double shuttle system makes it possible to laser on one shuttle and mill on the other. This means that the processes can be used in parallel or in combination, which is particularly suitable for sensitive rigid-flex printed circuit boards consisting of rigid and flexible components, for example.

End-of-line complete solutions from a single source

The "ILR Perfomance" depaneling system is usually seamlessly integrated inline into a process chain. However, it can also be individually adapted to customer processes - from automated loading to depositing. The trade fair setup, created in close partnership with the automation experts from Omron, shows how the depaneling robot flexibly completes a process chain and cooperates with other systems: An AMR robot from Omron takes care of loading, while a Schunk dual loader feeds the panels.

Seamlessly integrated into the process chain, the "ILR Performance" separates PCBs with high precision. © SCHUNK SE & Co. KG

After high-precision separation in the user separator, the PCBs pass through a process station that covers testing, cleaning, AOI, dispensing or other steps as required. The assemblies are then automatically recognized, gripped and deposited using the AI-supported 2D grasping kit from Schunk, which won the Hermes Award 2024.

The storage system demonstrates its versatility: from palletizer to flat belt to transfer by shuttle. The modular design enables extensions to be made even during operation.

Productronica, Hall A3, Stand 248