Sensors
Component behavior
With the Aramis SRX, GOM is expanding its range of 3D sensors for the dynamic acquisition of 3D coordinates, 3D displacements and surface strains. These systems measure samples and components in a non-contact and material-independent manner using the principle of digital image correlation (DIC).
They provide information about the properties of the materials used and the behavior of the resulting components under load. The results form the basis for product durability, geometry layout and reliable numerical simulations and their validation. Thanks to the latest camera technology, the SRX has a high resolution of twelve megapixels and is used for various applications. Up to 2,000 images per second can be recorded for high-speed material and component testing. This allows, for example, the failure behavior of components to be recorded locally and with high temporal resolution. A special HD mode has been developed for crash applications; this enables comprehensive analyses of fast processes in high resolution with an image recording frequency of 1,000 hertz. pb
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