
From high-end to ultra-low power
Congatec presents the entire spectrum of embedded edge computing logic, ranging from high-end edge servers to headless systems for ultra-low-power edge logic.

Congatec presents the entire spectrum of embedded edge computing logic, ranging from high-end edge servers to headless systems for ultra-low-power edge logic.

Technologies for data acquisition

Aries Embedded presents its new C-Vision kit. The kit is a design platform for industrial applications with embedded vision and artificial intelligence. It enables the processing and evaluation of image data.

Kontron is adding the Smartcase chassis kits from Fujitsu to its portfolio. Five variants are currently available: S500, S520, S700, S710 and S720. These serve as the basis for fully assembled box PCs consisting of Kontron motherboards including cooling and housing.


Franz Binder Elektrische Bauelemente founded Binder Swiss AG in January to broaden its international base.

GFT Technologies is implementing a proof of concept for Schinko that centrally networks the housing manufacturer's machinery using the IoT platform sphinx open online.

Test solutions for electronic systems
At Embedded World, Rohde & Schwarz will be presenting its measurement technology for embedded designs in the automotive sector, for high-speed digital interfaces and Bluetooth. The company is also celebrating the tenth anniversary of its oscilloscopes.

System concepts for embedded technologies
Rutronik's presence at Embedded World will focus on new Bluetooth standards, IoT and 5G applications and display technologies.

At Embedded World, SSV Software Systems will be presenting the System Development Kit (SDK), which can be used to retrofit next-generation IoT applications today with the help of sensors, gateways and AI services.