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Presence fair in preparation

Software for assembly conquers Motek/Bondexpo 2021

This year's Motek/Bondexpo is in full preparation as a presence trade fair. The industry is looking forward to the traditional trade fair duo, the 39th Motek - International Trade Fair for Production and Assembly Automation and the 14th Bondexpo - International Trade Fair for Adhesive Bonding Technology. The topic of "Software for Assembly" and the "Arena of Integration" will occupy a central place in Hall 1.

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