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Digitization

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Presence fair in preparation

Software for assembly conquers Motek/Bondexpo 2021

This year's Motek/Bondexpo is in full preparation as a presence trade fair. The industry is looking forward to the traditional trade fair duo, the 39th Motek - International Trade Fair for Production and Assembly Automation and the 14th Bondexpo - International Trade Fair for Adhesive Bonding Technology. The topic of "Software for Assembly" and the "Arena of Integration" will occupy a central place in Hall 1.

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Editorial

Things are looking up ...

... all indicators point to this. At most of the annual press conferences attended by the editorial team in recent weeks, the company managements looked to the future with positive expectations.

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