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Embedded World 2018

Electronic housings from Bopla for Industry 4.0

Networked applications and the Internet of Things require one thing above all else - reliably functioning electronic devices. The product portfolio of Bopla Gehäusesysteme GmbH includes a wide range of electronic enclosures that are tailored to the requirements of Industry 4.0 applications - including the new IOT sensor enclosures and BoPad enclosures for HMI applications. In addition to the installation of electronics in the enclosures, the enclosure specialist also offers the integration of touchscreens and displays. The company will be presenting its enclosure solutions and services for IoT at Embedded World.

Bopla Gehäusesysteme GmbH offers a wide range of electronic enclosures that are designed to meet the requirements of I 4.0 applications

The compact IoT sensor housings made of flame-retardant, self-extinguishing PC UL94 V-0 offer space for the sensor, wireless module and power supply and are also suitable for outdoor use thanks to the molded-in holder for the integration of a pressure compensation element. Depending on the type of power required for the wireless technology, Bopla offers the small plastic housing in three heights: 15 mm for a button cell, 22 mm for three AAA micro batteries and 26 mm for a CR 14250 lithium battery. Thanks to a modular tool concept with a basic tool mould and various inserts for moulding different housing heights, wall brackets and screw connection options, a total of 18 variants of the basic IoT housing type can be created.

Focus on the human-machine interface

For HMI applications, Bopla offers the modern, compact enclosures of the new BoPad series for the integration of membrane keyboards, touchscreens and displays. In particular, the two "large" of the five BoPad enclosure variants - BOP 7.0 and BOP 10.1 for desktop and wall-mounted applications - have been specially optimized for touch integration and for accommodating standard 18650 lithium-ion batteries. They are designed for two-handed operation in landscape format and allow the realization of cost-efficient and user-friendly devices with touch operation. The integration of capacitive touch displays under a high-quality glass front can be carried out in-house at Bopla - for example using the optical bonding process.

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Incidentally, touchscreens and displays can be installed in almost all other standard housings as well as in customer-specific electronic housings, e.g. in hand-held, desktop or wall-mounted housings.

Embedded World, Hall 3, Stand 155

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